The Pcore™6 HPD Mini SiC MOSFET module is ahigh-performance, high-power and compact power module designed specifically for the main drive inverters of electric vehicles. Equipped with BASiC Semiconductor’s self-developed third-generation automotive SiC MOSFET, the module adopts advanced pressure-assisted silver sintering process and high-density copper wire bonding technology, alongside Si3N4 AMB ceramic substrate and a direct liquid-cooled Pin Fin structure. The product features low losses, high breakdown voltage, low on-resistance, high current density and high reliability (exceeding the AQG-324 reference standard).
Parameter List (Standard)
| Product | VDSS（V） | ID（A） | RDS(on)（mΩ）（@Tvj=25℃） | Die/Switch
| Terminal | Package Name |
| BMS510R12HMWA3_A01 | 1200 | 510 | 2.0 | 6-in-Para | Standard | HPD Mini |
| BMS380R12HMWA3_A01 | 1200 | 380 | 3.0 | 4-in-Para |
| BMS630R08HMWA3_A01 | 750 | 630 | 1.6 | 6-in-Para |
| BMS460R08HMWA3_A01 | 750
| 460 | 2.5 | 4-in-Para |
Parameter List (Long AC Terminal)
| Product | VDSS（V） | ID（A） | RDS(on)（mΩ）（@Tvj=25℃） | Die/Switch | Terminal | Package Name |
| BMS510R12HMLWA3_A01/A02 | 1200 | 510 | 2.0 | 6-in-Para | Long | HPD Mini |
| BMS380R12HMLWA3_A01/A02 | 1200 | 380 | 3.0 | 4-in-Para |
| BMS630R08HMLWA3_A01/A02 | 750 | 630 | 1.6 | 6-in-Para |
| BMS460R08HMLWA3_A01/A02 | 750
| 460 | 2.5 | 4-in-Para |
A01_Standard AC terminal: 30mm
A02_Extended AC terminal: 32mm
