BASiC Semiconductor Shines at PCIM Europe, Globally Debuts Multiple New SiC ProductsIssuing time:2025-05-08 19:00  In the morning of May 6th local time, PCIM Europe 2025—the world's top event in the field of power electronics—opened at the Nuremberg Exhibition Center in Germany. BASiC Semiconductor showcased its full range of SiC power devices and gate driver solutions, and released multiple new products such as new-generation SiC MOSFET discretes, industrial and automotive SiC power modules, etc. 01 62mm Industrial Half-Bridge SiC MOSFET Module BASiC launches 62mm industrial half-bridge SiC MOSFET module that adopts the latest generation of SiC MOSFET technology. This module design has been further optimized to reduce module stray inductance based on the traditional 62mm package, which allows the high-frequency performance of SiC MOSFET to be fully utilized.  02 Pcore™12 EP2 Industrial SiC MOSFET Module Pcore™12 EP2 industrial SiC MOSFET three-phase bridge module BMS065MR12EP2CA2 adopts the latest generation of SiC MOSFET technology and NTC temperature sensor, innovatively integrating dual three-phase bridges serving as rectifier and inverter. Thanks to its optimized design, the product effectively enables system cost savings, providing customers with more efficient and reliable power solutions.  03 New-Generation SiC MOSFET Series During the PCIM exhibition, BASiC Semiconductor officially launched its new generation of SiC MOSFET series, with initial specifications targeting multiple application fields: For EV traction systems: 1200V/13.5mΩ and 750V/10.5mΩ series For photovoltaic & energy storage: 1200V/40mΩ series For AI power supplies & household storage inverters: 650V/40mΩ series This series of new products have significant improvements in system efficiency, high temperature performance and power losses, providing a more efficient and economical power device solution for the new energy applications.  Parameter List   In addition, BASiC Semiconductor also exhibited multiple new automotive SiC power modules at the exhibition, including: Pcore™2 - Automotive Embedded Power Module using High Performance Ceramic, Pcore™X - Automotive Low Profile Transfer Mold SiC Power Module and Pcore™1 - Automotive TPAK SiC MOSFET Module. |
